For prod & multiple products dev
The ALOX GEN1.4L Auto is the newest addition to the ALOXTEC portfolio: an equipment that combines the compactness and characterization richness of the ALOX GEN1.4L Manual with automated wafer loading and a groundbreaking process innovation that redefines uniformity standards for wet thermal oxidation.
60+ tools used worldwide in 21 customers sites
Support and Sales representatives in EU, Asia & US
| Specification | Value |
|---|---|
| Throughput | 800–1000 wafers/month |
| Wafer sizes | 3” to 8” |
| Loading |
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| Process window |
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| With UniformPerf© (factory option or field upgrade) |
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| Without UniformPerf© |
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| 4 in 1 capability | Automatic loading & unloading + Oxidation + Characterization + Annealing in a single cycle |
| Low W2W dev. | σ < 0.05 µm on 6” wafers |
| Proprietary vision system |
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| High homogeneity chamber |
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| Supervision and vision software |
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For the first time in wet thermal oxidation, the ALOX GEN1.4L Auto introduces wafer rotation during the oxidation phase. This innovation optimizes oxidation uniformity across the wafer by precisely controlling local temperature and water vapour gradients within the furnace chamber, ensuring consistent oxidation rates across all areas.
By rotating the wafer during oxidation, the ALOX GEN1.4L Auto averages out these gradients across the full wafer surface. In addition, ALOXTEC’s proprietary in-situ vision system continues to operate and provide real-time measurements throughout the rotation: a technical achievement that represents a world first in the field.
The ALOX GEN1.4L Auto delivers outstanding uniformity, with aperture variation staying within σ < 0.25 µm on 6″ (without our UniformPerf© option), and a Run-to-Run average oxidation aperture under 0.2 µm. Its innovative ‘Stop on exact aperture size’ automated process, combined with an in-line real-time vision system, ensures a highly repeatable and controlled oxidation — proven across the full range of EPI complexity, from 3 to several hundred epitaxial layers.
The ALOX GEN1.4L Auto offers full process control over the three critical parameters of thermal oxidation: pressure (from a few mbar to atmospheric), temperature (up to 600°C), and water vapor flow (5 g/h to 100 g/h). Multi-zone heating architecture compensates for EPI wafer-to-wafer variability, while low-pressure process capability combined with in-situ annealing ensures high-reliability oxide layers. This complete parametric control enables precise shaping of mesa geometries to meet the most demanding VCSEL device specifications.
Designed for both R&D and high-volume production environments, the ALOX GEN1.4L Auto supports wafer formats from 3″ to 8″ with an industrial throughput of up to 1000 wafers per month, directly impacting yield and time-to-market. As a 3-in-1 equipment integrating Oxidation, Annealing, and Characterization in a single tool, it significantly reduces CAPEX and OPEX footprint. The equipment features a user-friendly HMI, full SECS/GEM connectivity, and flexible loading modes — manual or automatic — backed by local support, spare parts availability, and dedicated training services.
We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.