Manual VCSEL Oxidation Furnace | ALOX GEN1.4L Manual

ALOX GEN1.4L Manual

For R&D and small-volume production

The ALOX GEN1.4L Manual is the best entry point to ALOXTEC’s industrial wet thermal oxidation portfolio: a compact, full-capability equipment engineered for research laboratories, university cleanrooms and development-phase production environments. It delivers the complete process precision of the ALOXTEC portfolio in a footprint optimized for R&D workflows.

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Technical specifications of the ALOX GEN1.4L Manual

Specification	Value
Throughput	200-600 wafers/month
Wafer sizes	3” to 8”
Loading	Manual wafer loading SECS/GEM connectivity Full operator control for R&D flexibility
Process window	Temperature 350°C to 600°C Pressure few mbar to 800 mbar Water flow 0.6 to 30 g/h
With UniformPerf© (factory option or field upgrade)	Run-to-run σ < 0.1 µm Aperture size min-max < ±0.3 µm on 6’’
Without UniformPerf©	Run-to-run σ < 0.25 µm Aperture size min-max < ±0.6 µm on 6’’ wafers
3 in 1 capability	Oxidation + Characterization + Annealing in a single cycle
Proprietary vision system	In situ live vision Automatic “stop on right oxidation diameter” Aperture target until 3 µm X/Y/Z motion with full wafer view 2 cameras (low and high magnification) Monochromator capability included
High homogeneity chamber	Anti bow system Several heating zones control 1 gas lines for optimised reliability
Supervision and vision software	User friendly interface Automatic pattern recognition Automatic process & measurement algorithms

The best “all-in-one” equipment for high-performance VCSELs oxidation

The 2026 innovation: rotation and in-situ measurement during oxidation

For the first time in wet thermal oxidation, the ALOX GEN1.4L Manual introduces wafer rotation during the oxidation phase. This innovation optimizes oxidation uniformity across the wafer by precisely controlling local temperature and water vapour gradients within the furnace chamber, ensuring consistent oxidation rates across all areas.

By rotating the wafer during oxidation, the ALOX GEN1.4L Manual averages out these gradients across the full wafer surface. In addition, ALOXTEC’s proprietary in-situ vision system continues to operate and provide real-time measurements throughout the rotation: a technical achievement that represents a world first in the field.

A field-proven ‘Stop on exact aperture size’ automated process, integrated with an in-line real-time vision system.

The ALOX GEN1.4L Manual achieves exceptional process uniformity, with aperture variation staying within σ < 0.25 µm on 6″ (without our UniformPerf© option), and a Run-to-Run average oxidation aperture deviation below 0.2 µm. Combining a field-proven ‘Stop on exact aperture size’ automated process with an in-line real-time vision system, the tool guarantees highly controlled and repeatable oxidation results — validated across the full spectrum of EPI complexity, ranging from 3 to several hundred epitaxial layers.

Complete process control over Pressure (from few mbar to PA), Temperature (up to 600°C), and Water Vapor Flow (5 g/h to 100 g/h)

The ALOX GEN1.4L Manual provides comprehensive control over all three critical parameters governing thermal oxidation: pressure (ranging from a few mbar up to atmospheric pressure), temperature (reaching up to 600°C), and water vapor flow rate (from 5 g/h to 100 g/h). A multi-zone heating architecture effectively compensates for EPI wafer-to-wafer variability, while the combination of low-pressure process capability with in-situ annealing produces highly reliable oxide layers. This full parametric control allows for precise mesa geometry tailoring to satisfy the most stringent VCSELs device requirements.

Industry-leading TCO (Total Cost of Ownership)

Suited for both research and development settings and low-to-mid volume production, the ALOX GEN1.4L Manual accommodates wafer sizes from 3″ to 8″, with an industrial throughput reaching up to 600 wafers per month. By consolidating Oxidation, Annealing, and Characterization into a single 3-in-1 equipment, it delivers a significantly reduced CAPEX and OPEX footprint compared to multi-tool approaches. The equipment integrates an intuitive HMI interface, full SECS/GEM compatibility, and adaptable loading configurations — including both manual and automatic modes — supported by local technical assistance, readily available spare parts, and comprehensive training programs.