For High-Volume production
As AI-driven demand for VCSELs accelerates across datacom, 3D sensing, automotive and industrial applications, leading manufacturers are scaling oxidation capacity to match. The ALOX GEN2.0 HV Auto is ALOXTEC’s answer: a next-generation, fully automated high-volume wet thermal oxidation furnace delivering up to 2400 wafers per month with the same process performance that has made the ALOXTEC equipment the global production reference tool for VCSEL wet thermal oxidation.
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| Specification | Value |
|---|---|
| Throughput | 1800 – 2400 wafers/month |
| Wafer sizes | 3” to 8” |
| Loading |
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| Process window |
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| With UniformPerf© (factory option or field upgrade) |
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| Without UniformPerf© |
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| 4 in 1 capability | Automatic loading & unloading + Oxidation + Characterization + Annealing in a single cycle |
| Proprietary vision system |
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| High homogeneity chamber |
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| Supervision and vision software |
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| Availability | Presales open, contact ALOXTEC for configuration and lead time |
The ALOX GEN2.0 HV Auto achieves exceptional process uniformity, with aperture variation staying within σ < 0.25 µm on 6″ (without our UniformPerf© option), and a Run-to-Run average oxidation aperture deviation below 0.2 µm. Combining a field-proven ‘Stop on exact aperture size’ automated process with an in-line real-time vision system, the tool guarantees highly controlled and repeatable oxidation results — validated across the full spectrum of EPI complexity, ranging from 3 to several hundred epitaxial layers.
The ALOX GEN2.0 HV Auto provides comprehensive control over all three critical parameters governing thermal oxidation: pressure (ranging from a few mbar up to atmospheric pressure), temperature (reaching up to 600°C), and water vapor flow rate (from 5 g/h to 100 g/h). A multi-zone heating architecture effectively compensates for EPI wafer-to-wafer variability, while the combination of low-pressure process capability with in-situ annealing produces highly reliable oxide layers. This full parametric control allows for precise mesa geometry tailoring to satisfy the most stringent VCSELs device requirements.
The ALOX GEN2.0 HV Auto shares the same oxidation process chamber geometry, gas delivery architecture and proprietary in-situ vision system as the GEN1.4L Auto. All process recipes transfer directly — without any tool effect or process requalification cost.
Suited for high-volume production, the ALOX GEN2.0 HV Auto accommodates wafer sizes from 3″ to 8″, with an industrial throughput reaching up to 2400 wafers per month. By consolidating Oxidation, Annealing, and Characterization into a single 3-in-1 equipment, it delivers a significantly reduced CAPEX and OPEX footprint compared to multi-tool approaches. The equipment features an intuitive HMI interface, full SECS/GEM compatibility, and adaptable loading configurations — including both manual and automatic modes — supported by local technical assistance, readily available spare parts, and comprehensive training programs.
For the first time in wet thermal oxidation, ALOXTEC introduces wafer rotation during the oxidation phase. This innovation addresses the root cause of residual aperture non-uniformity: local temperature and water vapour gradients within the furnace chamber that cause different areas of the wafer to oxidize at slightly different rates.
By rotating the wafer during oxidation, ALOXTEC averages out these gradients across the full wafer surface. In addition, ALOXTEC’s proprietary in-situ vision system continues to operate and provide real-time measurements throughout the rotation: a technical achievement that represents a world first in the field.
We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.
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